High Density Cell Electrofusion on Chip using an Array of Non-connected Metallic Pads

Feriel Hamdi, Wei Wang, Frederic Subra, Elisabeth Dufour-Gergam, Olivier Français, Bruno Le Pioufle

2013

Abstract

Cell fusion consists on creating a hybridoma cell containing the genetic properties of the progenitor cells. It can be performed chemically or electrically. The latter method, called Electrofusion, is a more efficient way to create hybrid cells investigated for antibody production or cancer immunotherapy. To envision this application, a high amount of hybrid cells is needed. This work presents an original design for high density electrofusion on chip. The structure consists of an array of non-connected electroplated gold pads patterned between two connected electrodes. While applying a Voltage on the connected electrodes, the Electric field is disturbed around the gold pads inducing a Dielectrophoretic Force on cells used to trap and pair them. When cells are paired, Electric pulses are applied to induce electrofusion. The absence of wire connections on the pads permits the high density trapping and electrofusion. Successful alignment and electrofusion of murine melanoma cells with this structure are demonstrated.

Paper Citation

in Harvard Style

Hamdi F., Wang W., Subra F., Dufour-Gergam E., Français O. and Le Pioufle B. (2013). High Density Cell Electrofusion on Chip using an Array of Non-connected Metallic Pads . In Proceedings of the International Conference on Biomedical Electronics and Devices - Volume 1: BIODEVICES, (BIOSTEC 2013) ISBN 978-989-8565-34-1, pages 68-72. DOI: 10.5220/0004246100680072

in Bibtex Style

@conference{biodevices13,
author={Feriel Hamdi and Wei Wang and Frederic Subra and Elisabeth Dufour-Gergam and Olivier Français and Bruno Le Pioufle},
title={High Density Cell Electrofusion on Chip using an Array of Non-connected Metallic Pads},
booktitle={Proceedings of the International Conference on Biomedical Electronics and Devices - Volume 1: BIODEVICES, (BIOSTEC 2013)},
year={2013},
pages={68-72},
publisher={SciTePress},
organization={INSTICC},
doi={10.5220/0004246100680072},
isbn={978-989-8565-34-1},
}

in EndNote Style

TY - CONF
JO - Proceedings of the International Conference on Biomedical Electronics and Devices - Volume 1: BIODEVICES, (BIOSTEC 2013)
TI - High Density Cell Electrofusion on Chip using an Array of Non-connected Metallic Pads
SN - 978-989-8565-34-1
AU - Hamdi F.
AU - Wang W.
AU - Subra F.
AU - Dufour-Gergam E.
AU - Français O.
AU - Le Pioufle B.
PY - 2013
SP - 68
EP - 72
DO - 10.5220/0004246100680072